Epoxy resin electrical encapsulation composition
US5089543A · kind A · utility
4Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 1991 |
| Grant date | Feb 18, 1992 |
| Priority date | — |
| Expiry date | Feb 15, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/621
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An electrical encapsulation composition containing an epoxy resin, a phenolic curing agent and a tris(dialkoxyphenyl)phosphine high cured glass transition temperature and good crack resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.