Patent · US Expired

Atomized thin film forming apparatus

US5090360A · kind A · utility

5Cited by
4References
5Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 3, 1991
Grant dateFeb 25, 1992
Priority date
Expiry dateJan 3, 2011

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02E10/50
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

There is disclosed an atomized thin film forming apparatus for forming a thin film by spouting an atomized source solution toward a heated substrate. A pair of inner wall surfaces defined at the upper portion of a film forming nozzle and disposed opposite to each other with respect to the longitudinal direction of a film forming chamber are restricted so as to gradually narrow in the interval therebetween toward a spouting opening in a smooth curve. Hence, it is possible to prevent a mist of the source solution atomized by the atomizer from being locally stagnant in the film forming nozzle and prevent a precipitate of the atomized source solution from growing. Consequently, the flow of the mist of the source solution is not hindered by the precipitation of the atomized source solution so that the thin film is formed over the surface of the substrate at a high uniformity for a long period of time.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.