Modular connector system
US5090911A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 7, 1991 |
| Grant date | Feb 25, 1992 |
| Priority date | — |
| Expiry date | Feb 7, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/508
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A connector is described, which has several rows of contacts connected to two rows of leads that engage terminals on a circuit board assembly, which enables a large number of contacts to be located in a connector of moderate cost. A connector insert comprises a wafer device (44, FIG. 3) and multiple leads, the leads having front lead portions (50) connected to multiple rows of contacts (30) on the wafer device, middle lead portions (56) molded into the wafer device, and rearward lead portions (52) lying in two parallel rows for contacting terminals on opposite sides of the circuit board assembly. Each wafer device includes two substantially identical wafers (74, 76, FIG. 6), to allow molding of a single row of leads at a time into a wafer. Each wafer has forwardly projecting towers (130, FIG. 5) that each lie around the front portion of a lead, and each contact has a periphery captured by a tower portion and a hole that receives a lead front portion. The contacts are arranged in columns on the wafer device, with at least four contacts in each column, and some of the lead middle portions extend both laterally and longitudinally to provide a small spacing or pitch of the lead rear po…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.