Improvements in the encapsulation of electronic components employing low stress encapsulant composition
US5091135A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 1989 |
| Grant date | Feb 25, 1992 |
| Priority date | — |
| Expiry date | Oct 13, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An improved method for encapsulating an electronic component with a highly stable protective layer is provided. Such encapsulation is carried out by injection molding about the surface of the electronic component of an encapsulant composition comprising a molten melt-processable polyester which is capable of forming an anisotropic melt phase having uniformly blended therein about 0.1 to 30 percent by weight based upon the total weight of the composition of silicone oil and/or a silicone rubber. Quality encapsulation is made possible under conditions wherein damage to the electronic component is minimized, and the resulting product is well protected without damage under a wide variety of end use conditions including variations in temperature. The process is carried out in the substantial absence of deleterious mold shrinkage and the product exhibits an extremely low linear coefficient of thermal expansion which well protects the electronic component encased therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.