Method for preparing superconductor sputtering target
US5091221A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1990 |
| Grant date | Feb 25, 1992 |
| Priority date | — |
| Expiry date | Aug 22, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/741
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for preparing a superconductor sputtering target is disclosed in which sputtering targets for coating superconductor films can be prepared essentially by mixing oxides (carbonates or fluorides) of metals such as Y, Ba, Cu (Bi, Pb), Sr, Ca,Cu) with the atomic ratio of individual elements be controlled in a specific range, an oxide superconductor paste being prepared by blending an organic binder and an organic solvent according to a specific solid percentage, and a metal such as aluminum being used as the substrate; by scraping with a squeegee and adjusting the distance between a stencil and the substrate such that the superconductor paste seeps through a mesh to be printed on the substrate and then dried; after scraping, screen-printing and drying having been repeated several times, the substrate being placed into an oven and heated to a temperature of 400.degree.-450.degree. C., at a rate of less than 5.degree. C./min, for 30 minutes and then cooled down to room temperature at the same rate of less than 5.degree. C./min.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.