Paperboard/polymer laminate for blister pack
US5091261A · kind A · utility
21Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1990 |
| Grant date | Feb 25, 1992 |
| Priority date | — |
| Expiry date | Apr 16, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31993
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A laminate for blister pack applications is comprised of a paperboard substrate having a first printable surface and a second surface onto which there is applied a polymeric coating suitable for adhering the plastic blister to the paperboard. The polymeric coating comprises a coextrusion consisting of a polyolefin material such as low density polyethylene (LDPE) which gives good adhesion to the paperboard surface and an adhesive material such as an ethylene-methyl acrylate copolymer (EMA) which gives good adhesion to the plastic blister.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.