Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member
US5091341A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 1990 |
| Grant date | Feb 25, 1992 |
| Priority date | — |
| Expiry date | May 17, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of sealing a semiconductor device with resin includes the steps of coupling the tie bar of a lead frame to a heat sink; die bonding a semiconductor chip to the surface of the heat sink; wire bonding and electrically connecting the semiconductor chip to leads of the lead frame; placing the heat sink on the bottom surface of a cavity of a lower mold, putting an upper mold on the lower mold, and pressing down the coupling portion between the heat sink and lead frame toward the bottom surface by using a pressure member mounted on the upper mold; and injecting melted resin within the cavity defined by the upper and lower molds, and hardening the resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.