Molding resin
US5091470A · kind A · utility
18Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 1990 |
| Grant date | Feb 25, 1992 |
| Priority date | — |
| Expiry date | Sep 10, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L51/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic rubber modified molding compositions containing N-phenyl maleimide, acrylonitrile, and at least one copolymerizable comonomer suitable for preparing moldings having low surface gloss.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.