Epoxy resin curing agent based on blends containing disecondary aromatic diamines
US5091474A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 1991 |
| Grant date | Feb 25, 1992 |
| Priority date | — |
| Expiry date | Jan 18, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/56
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A two component-type curing agent composition is disclosed which comprises a first curing agent which is capable of cross-linking an epoxy resin and which is at least one member selected from primary amines, phenolic compounds and acid anhydrides, and a second curing agent which is at least one compounds represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attracting group; R is a lower alkyl; and m and n each is an integer of 1-4.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.