Patent · US Expired

Thermoplastic molding materials

US5091477A · kind A · utility

8Cited by

6References

8Claims

0Family size

Assignee

BASF SE

Inventors

Rainer Bueschl · Bad Dürkheim, DE
Peter Klaerner · Battenberg, DE

Key dates

Filing date	Mar 16, 1990
Grant date	Feb 25, 1992
Priority date	—
Expiry date	Mar 16, 2010

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S525/905
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Molding materials of high impact polystyrene (HIPS) and one or more further polymers as essential components contain, as a third or further compatibility-imparting component, a polymer or copolymer containing not less than 45% by weight of units of cyclohexyl (meth)acrylate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.