Method and apparatus for bonding external leads
US5092031A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1991 |
| Grant date | Mar 3, 1992 |
| Priority date | — |
| Expiry date | Mar 27, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for bonding external leads of a solid state device to a lead frame, where a positional discrepancy between the solid state device and the lead frame is corrected not only in X-Y directions but also in the rotational direction so as to perform a high accuracy bonding. Discrepancies in the rotational direction are calculated after detecting two points of the solid-state device, and a sunction head holding such solid-state device is rotated to correct such discrepancy. One portion of the solid-state device is further detected and the discrepancy in X-Y direction is calculated so as to correct the relative positional discrepancy of the solid-state device and the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.