Method for packaging semiconductor device
US5092033A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 1991 |
| Grant date | Mar 3, 1992 |
| Priority date | — |
| Expiry date | Jan 23, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention comprises the steps of electrically connecting at least one pair of bumps on the semiconductor device, bringing the bumps into contact with a surface of the packaging substrate and moving the semiconductor device relative to the packaging substrate while monitoring whether at least one pair of electrode terminals formed on the surface of the packaging substrate are electrically connected to each other, positioning the semiconductor device with respect to the packaging substrate at a position where the electrode terminals whose electrical connection is monitored are electrically connected to each other, and packaging the semiconductor electrode on the packaging substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.