Method and apparatus for circuit board support during component mounting
US5092510A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1990 |
| Grant date | Mar 3, 1992 |
| Priority date | — |
| Expiry date | Nov 20, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0069
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The method and apparatus of the present invention may be utilized to support a selected mounting point on a circuit board during the mounting an electronic component. An integrated circuit device is selected and positioned adjacent a first side of a circuit board at a desired mounting point utilizing a robotic manipulator and a placement head. A support fixture is then urged into temporary contact with a second side of the circuit board utilizing a flexible mounting system such that minor variations or misalignments between the plane of the support fixture, the circuit board and the placement head are eliminated. In one embodiment of the present invention a flexible fluid filled bag is utilized in conjunction with the support fixture so that the presence of components on the second side of the circuit board may be accommodated while supporting the circuit board during component mounting. Finally, the requirement for providing a robotic manipulator and placement head capable of generating the substantial downward forces necesary to create a bond between a circuit board and an electronic component is eliminated by positioning the placement head and heated bonding tool proximate to th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.