Patent · US Expired

Holding device and method for treating wafer-like objects, and a method of treating them

US5093550A · kind A · utility

22Cited by

3References

14Claims

0Family size

Assignee

Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

Hans Gerber · Burghausen, DE
Georg Hochgesang · Burghausen, DE
Alfred Pardubitzki · Burghausen, DE
Manfred Schmiedlindl · Altötting, DE
Werner Zipf · Töging, DE
Arthur Schweighofer · Burghausen, DE

Key dates

Filing date	Apr 10, 1990
Grant date	Mar 3, 1992
Priority date	—
Expiry date	Apr 10, 2010

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S134/902
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A wafer holding device including a frame (2) which surrounds a wafer (1) ch is received without contact, which can be moved with the wafer having at least three holding elements (3) which are directed toward the outside circumference of the wafer and which can be changed from a holding position to a release position. The wafer can be supported in the holding device during many steps associated with movement in the production process so that a multiplicity of gripping and release operations which stress the wafer surface are unnecessary.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.