System for automated mounting of electronic components to circuit boards
US5094381A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1990 |
| Grant date | Mar 10, 1992 |
| Priority date | — |
| Expiry date | Nov 20, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0465
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The apparatus of the present invention may be utilized for the automated bonding of electronic components to a circuit board. A placement and bonding head is attached to a manipulatable robotic arm and is utilized to select an electronic component having a plurality of conductive leads from a supply of such components and position that component adjacent a plurality of contact pads on a circuit board. While retaining the electronic component within the placement and bonding head, the component is then thermally bonded to the contact pads. In one embodiment of the present invention, an electronic component may be optically inspected while being retained within the placement and bonding head. In another embodiment, thermal bonding is accomplished utilizing a plurality of thermally activatable blades which each include a thermocouple mounted adjacent thereto. Selective low current control signals are then coupled to the placement and bonding head where transformers are utilized to amplify the current prior to coupling the control signal to individually thermally activatable blades. In yet another embodiment of the present invention, the placement and bonding head includes a plenum for…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.