Method for making a stackable multilayer substrate for mounting integrated circuits
US5094969A · kind A · utility
7Cited by
5References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 9, 1990 |
| Grant date | Mar 10, 1992 |
| Priority date | — |
| Expiry date | Oct 9, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate is formed from a core substrate of flexible, low-temeprature co-fireable ceramic tape and an outer substrate of ceramic tape having apertures for receiving integrated circuits (ICs) therein. The substrate is heated the form a rigid body which then mounts the ICs. The rigid body and ICs are covered or at least partially covered with an insulating glass and heated to a temperature that fuses the glass but does not harm the ICs. The resulting structure hermetically seals the ICs in a single substrate that is insensitive to acceleration forces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.