Epoxy resin composition and multilayer printed wiring board having insulating layer formed therefrom
US5095047A · kind A · utility
2Cited by
0References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1990 |
| Grant date | Mar 10, 1992 |
| Priority date | — |
| Expiry date | Apr 2, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0251
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed wiring board is disclosed which includes a bisphenol AD epoxy resin, an aromatic polyamine, mica having an average particle size of 50 .mu.m or less, and silica having an average particle size of 20 .mu.m or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80% based on the total weight of the silica and the mica.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.