Microencapsulation method, microelectronic devices made therefrom, and heat curable compositions
US5095053A · kind A · utility
5Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1991 |
| Grant date | Mar 10, 1992 |
| Priority date | — |
| Expiry date | Jan 14, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.