Release silicone emulsion composition
US5095067A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 1988 |
| Grant date | Mar 10, 1992 |
| Priority date | — |
| Expiry date | Apr 20, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A release silicone emulsion composition comprising: PA1 (A) 100 parts by weight of a specific organovinylpolysiloxane; PA1 (B) from 1 to 50 parts by weight of a specific organohydrogenpolysiloxane; PA1 (C) from 0.5 part to 5 parts by weight of a platinum catalyst having a viscosity of 10 cSt or less at 25.degree. C.; PA1 (D) from 1.5 to 15 parts by weight of a nonionic emulsifying agent having an average HLB of from 10 to 20, pH of 6.5 or less and an ionic conductivity of 30 .mu..OMEGA..sup.-1 cm.sup.-1 or less; and PA1 (E) water. This composition has good pot life and curability. The cured film has good release properties and residual adhesive properties of adhesives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.