Patent · US Expired

Method of fabricating infrared detectors and the detector

US5095216A · kind A · utility

4Cited by
5References
16Claims
0Family size

Assignee

Inventor

Key dates

Filing dateSep 24, 1990
Grant dateMar 10, 1992
Priority date
Expiry dateSep 24, 2010

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10F71/1253

Abstract

A method of fabricating an infrared detector and the detector comprising providing a semiconductor layer of group II-VI material, providing an electrically insulating layer having vias therethrough at predetermined locations and having a coefficient of thermal expansion which substantially tracks the coefficient of thermal expansion of said layer, securing the semiconductor layer to the insulating layer, forming infrared detector elements on the semiconductor layer and vias through the semiconductor layer aligned with the vias through the insulating layer, securing the combined semiconductor and insulating layers to the surface of a signal processing semiconductor chip and forming electrical interconnects between the detector elements and the chip through the vias. Also, there is provided an attaching agent securing the chip to the insulating layer, the attaching agent being sufficiently strong to retain the attachment during thermal cycling during processing and receiving thermally caused stresses between the chip and the detector elements.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.