Semiconductor package and computer using the package
US5095359A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1989 |
| Grant date | Mar 10, 1992 |
| Priority date | — |
| Expiry date | Sep 28, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package for use in computers includes a insulating substrate onto which a semiconductor device is mounted, an insulating cap which shuts out outside air and seals said semiconductor device, power-source lines which provide power to the semiconductor device, and signal lines which transmit output signals from the semiconductor device to external circuits. The signal lines are arranged perpendicularly to the insulating substrate so that they are prevented from the dielectric constant of the insulating substrate, while the power-source lines are formed within the insulating substrate and connected through conductive layers parallel to the surface onto which the semiconductor is mounted to external leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.