Resin film recoating method and apparatus
US5096530A · kind A · utility
154Cited by
13References
52Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 28, 1990 |
| Grant date | Mar 17, 1992 |
| Priority date | — |
| Expiry date | Jun 28, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1093
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a system for fabricating an object by selective curing of successive films of curable resin formed separately from the object being formed. In a first preferred embodiment, a thin film is formed and selectively cured and stripped to form a layer of an object of predetermined pattern. In a second preferred embodiment, a carousel of funnels carries out parallel film formation and curing. A third preferred embodiment is disclosed having rotating carriers to achieve parallel film formation and curing. A fourth preferred embodiment is disclosed for forming very small objects of successive thin films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.