Semiconductor encapsulating epoxy resin compositions and semiconductor devices
US5096762A · kind A · utility
17Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1990 |
| Grant date | Mar 17, 1992 |
| Priority date | — |
| Expiry date | Feb 27, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/239
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition comprising an epoxy resin, a curing agent, a substantially pure alpha-alumina filler, and a silicone-modified epoxy or phenol resin is useful in encapsulating semiconductor devices. The composition can be molded and cured into a product having improved thermal conductivity and moisture resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.