Resin composition for forming durable protection coating and process for forming durable protection coating on substrate
US5096800A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1990 |
| Grant date | Mar 17, 1992 |
| Priority date | — |
| Expiry date | Nov 27, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/287
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resin composition for forming a durable protection coating contains (A) an alkali-soluble resin which is a polymer of a conjugated diene and has a monoamidated succinic acid group represented by the following formula (I) of: ##STR1## wherein R.sup.1 and R.sup.2 each stand for a hydrogen atom, a halogen atom or an organic residue having 1 to 3 carbon atoms; and R.sup.3 stands for an organic residue having 1 to 16 carbon atoms; (B) a pre-polymer having a photosensitive ethylenic double bond; and (C) a photopolymerization initiator. The mixing ratio by weight of the alkali-soluble resin (A) to the pre-polymer (B) ranges from 1:4 to 4:1. A process for preparing the durable protection coating contains applying the resin composition on a substrate, and exposing the resin composition to ultraviolet ray through a circuit pattern mask to cure the resin composition followed by development and after-curing to form the protection coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.