Resin composition for inner coat of semiconductor chip
US5096990A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Oct 19, 1989 |
| Grant date | Mar 17, 1992 |
| Priority date | — |
| Expiry date | Oct 19, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/70
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Resin compositions for the inner coat of semiconductors which include PA0 (A) 100 parts by weight of a polysiloxane having vinyl groups and having a viscosity of 100 to 800cP at 25.degree. C., said polysiloxane having a general formula ##STR1## in which V represents a vinyl group, Me represents a methyl group, Ph represents a phenyl group, R represents a methyl group or a phenyl group and both k and l represent natural numbers which are variables within the range of 0.01.ltoreq.l/(k+l).ltoreq.0.2, PA0 (B) 1 to 35 parts by weight of a polysiloxane haivng a viscosity of 2 to 500cP at 25.degree. C., said polysiloxane having a general formula ##STR2## in which Me represents a methyl group, and both m and n represent natural numbers which are variables within the range of 0.05.ltoreq.n/(M+n).ltoreq.0.3, PA0 (C) 0.1 to 20% by weight of a organopolysiloxane per total amount of the above-described (A) plus (B), the organopolysiloxane having, per molecule, at least one hydrogen atom bound with a silicon atom and at lest one group having the general formula (R.sub.1 O).sub.3 SiCH.sub.2 CH.sub.2 -- in which R.sub.1 represents a lower alkyl group or a group R.sub.2 (OCH.sub.2 CH.sub.2).sub.p -…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.