High resolution thermal printing device
US5097271A · kind A · utility
5Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1990 |
| Grant date | Mar 17, 1992 |
| Priority date | — |
| Expiry date | Oct 31, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
There is disclosed a high resolution thermal printing device including a 128-bit uni-directional integrated circuit, which is specially ordered, instead of a general integrated circuit. The electrical connection of the device is achieved by wedge wire bonding employing wedges. The integrated circuit has a plurality of power source connecting pads which are aligned on the central portion the integrated circuit in parallel with the transverse direction thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.