Lead frame lead located for wire bonder
US5097406A · kind A · utility
8Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 1989 |
| Grant date | Mar 17, 1992 |
| Priority date | — |
| Expiry date | Oct 3, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A lead frame locater is used to locate actual positions of lead frame leads in respect to the semiconductor chip to provide accurate wire bonding of the semiconductor chip to the lead frame leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.