Baths and process for chemical polishing of copper or copper alloy surfaces
US5098517A · kind A · utility
6Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 1990 |
| Grant date | Mar 24, 1992 |
| Priority date | — |
| Expiry date | Oct 24, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F3/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Baths for chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, phosphoric acid and tetraborate ions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.