Stable high solids, high thermal conductivity pastes
US5098609A · kind A · utility
53Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 1989 |
| Grant date | Mar 24, 1992 |
| Priority date | — |
| Expiry date | Nov 3, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A paste including a thermally conducting solid filler, a nonaqueous liquid carrier and a stabilizing dispersant. The pastes are highly concentrated, of low viscosity, electrically resistive, highly thermally conducting and stable. The pastes are easily applicable to electrical and electronic devices and may be removed therefrom with common solvents to access components where necessary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.