Conductive thermoplastic resin composition
US5098610A · kind A · utility
30Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1990 |
| Grant date | Mar 24, 1992 |
| Priority date | — |
| Expiry date | Oct 29, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L69/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is disclosed a conductive thermoplastic resin composition which comprises: PA1 (a) 30 to 86% by weight of a thermoplastic aromatic polycarbonate, PA1 (b) 2 to 15% by weight of a high density polyethylene having a density of 0.945 to 0.970 g/cm.sup.3 and a melt flow rate of 0.1 to 30 g/10 min, PA1 (c) 5 to 20% by weight of a glass fiber having an average diameter of 3 to 15 .mu.m and an average length of 0.05 to 10 mm, PA1 (d) 5 to 20% by weight of a carbon fiber having an average diameter of 3 to 20 .mu.m and an average length of 0.03 to 15 mm, and PA1 (e) 2 to 15% by weight of a conductive carbon black.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.