Method of molding a solid state image pickup device
US5098630A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 1989 |
| Grant date | Mar 24, 1992 |
| Priority date | — |
| Expiry date | Aug 21, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/555
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solid-state image pickup device comprises a semiconductor chip, a package with a recess in which said semiconductor chip is fixed, and a transparent protective member for protecting an image pickup surface of the semiconductor chip and guiding a light image onto the image pickup surface. The transparent protective member includes a transparent resin layer for covering the image pickup surface and the upper surface of the package without forming a space therebetween, and an incident surface formed on the resin layer in parallel to the image pickup surface. A method manufactures a solid-state image pickup device having a construction described above by using a mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.