Method of manufacturing a semiconductor device
US5098638A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 25, 1990 |
| Grant date | Mar 24, 1992 |
| Priority date | — |
| Expiry date | Apr 25, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/124
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a semiconductor device forms an intrinsic base layer by doping an impurity in the emitter polysilicon electrode into the intrinsic base region of the surface of a semiconductor substrate by heat treatment through the emitter lead-out part hole self-aligned to the base lead-out electrode. Thus, beneath the insulation film of the substrate surface between the base lead-out part hole and emitter lead-out part hole, the outer marginal part of the intrinsic base layer and the inner marginal part of the extrinsic base layer overlap uniformly. Still more, since the diffusion of the impurity by heat treatment is very fast in the polysilicon emitter electrode as compared with that in the silicon substrate, an extremely shallow intrinsic base layer may be formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.