Laminate for the formation of beam leads for IC chip bonding
US5098814A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 1990 |
| Grant date | Mar 24, 1992 |
| Priority date | — |
| Expiry date | Apr 26, 2010 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0957
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laminate, adapted for manufacturing frames of metal beam leads that are bonded to integrated circuit chips comprising: PA1 (a) a flexible metal strip PA1 (b) a layer of a first resist adhered to one surface of the metal strip, and PA1 (c) a layer of a second resist adhered to the opposite surface of the metal strip, wherein the second resist is a negative-working resist which forms a semi-interpenetrating polymer network-II upon curing and comprises a homogeneous blend. (A) a solvent soluble polyimide-siloxane containing about 0.5-30 weight percent silicon and (B) an ethylenically unsaturated multifunctional monomer. The siloxane units in the polyimide-siloxane have from 10 to about 200 ##STR1## linkages per unit, more preferably from about 15 to about 100 linkages, and most preferably from about 40 to about 100 linkages per siloxane unit. A second embodiment of the invention comprises a metal strip having one side thereof, a composition obtained by curing the above-identified curable composition. Curable compositions of this invention can be cured by either actinic radiation; for example, ultraviolet light, or by thermal radiation. In the cured composition, the polymer produced …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.