Hardening resin composition
US5098973A · kind A · utility
8Cited by
5References
7Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 23, 1990 |
| Grant date | Mar 24, 1992 |
| Priority date | — |
| Expiry date | May 23, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F290/062
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a hardening resin composition including a monomer represented by the formulas (1) or (2), a monomer represented by the formula (3), and epoxyacrylate or epoxymethacrylate. This composition is easily hardened at low temperature, weak in odor, small in shrinkage in hardening, excellent during durability against water and hot water, and thus suitable as the flooring material for a food processing factory, refrigerated warehouse, and cold storage. ##STR1## where R.sup.1 to R.sup.6, p and r are as defined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.