Alumina multilayer wiring substrate provided with high dielectric material layer
US5099388A · kind A · utility
19Cited by
1References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 15, 1990 |
| Grant date | Mar 24, 1992 |
| Priority date | — |
| Expiry date | Jun 15, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09309
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An alumina multilayer wiring substrate having a high dielectric, low inductance capacitor in the substrate on which a VLSI is to be mounted to effectively eliminate electrical noise(s) which may hinder the operation of the VLSI at high speed (frequency) is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.