Tape-automated bonding frame adapter system
US5099392A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1990 |
| Grant date | Mar 24, 1992 |
| Priority date | — |
| Expiry date | Apr 2, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A Tape-Automated Bonding (TAB) Frame Adapter System for providing an interface to a device having a plurality of closely spaced leads is disclosed. The preferred embodiment of the invention comprises a dielectric rectilinear adapter ring or platform that includes upper and lower surfaces. Four sidebars enclose a central aperture. Each pair of sidebars terminates in a corner junction which protrudes away from the central aperture. The sidebars bear rows of conductors which register with high density leads on the periphery of a TAB frame and a printed circuit board. Each corner junction is designed to include a through-hole, which is surrounded by a metal insert, and an alignment pin. The adapter ring is a critical element of a novel TAB assembly comprising a TAB frame bearing a chip, an elastomer, a lid, and a PC board. A set of screws fit in a set of holes in a lid and in a PC board to hold the entire assembly in compression. The conductors which form the interface are either metal strips that are draped over the adapter ring or protruding members which are embedded in slots formed in the adapter ring. The conductors are deployed in two interleaved rows, one along the edge closest …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.