Electronic package for high density applications
US5099393A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 1991 |
| Grant date | Mar 24, 1992 |
| Priority date | — |
| Expiry date | Mar 25, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/2414
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic package including a first circuitized substrate (e.g., printed circuit board) and a flexible circuitized substrate wherein the flexible substrate is precisely aligned in removable manner relative to the first substrate. This is accomplished utilizing a retention member and associated frame member, the flexible circuitized substrate being precisely aligned and secured to the frame member. Elastomeric pressure exertion members are utilized to exert pressure against each of a plurality of individual circuitized sections of the flexible circuit member to thus effect engagement between the flexible substrate's contacts and respective conductors which constitute part of the circuit on the first substrate. Moveable clamp members may also be used to engage extending posts of the retention member, said clamp members also possibly acting against a stiffener member located on the first substrate's opposite surface from the flexible substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.