Ribbed submounts for two dimensional stacked laser array
US5099488A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1991 |
| Grant date | Mar 24, 1992 |
| Priority date | — |
| Expiry date | Mar 27, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02492
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser array submount structure for assembly into a two-dimensional stacked array with precise separation between laser diodes of adjacent submounts. The submount includes a deformable metal layer, such as a soft solder, on one major surface of a laser array support plate. A spacer element having spaced apart ridges is disposed on the opposite major surface. A laser diode array is mounted on a front edge of the support plate. In a cold bonding step, submounts are pressed together causing ridges to penetrate the deformable metal layer to a specified depth. The displaced metal spreads into channels between the ridges, allowing pressing of multiple laser array submounts into stackes of precise total tolerance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.