Structural bonding and debonding system
US5100494A · kind A · utility
27Cited by
11References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 28, 1991 |
| Grant date | Mar 31, 1992 |
| Priority date | — |
| Expiry date | Jan 28, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/19
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Two pieces (12 and 14) of material are releasably bonded together with a thermoplastic adhesive (28) in which a heating element (30) is embedded. After application, the adhesive (28) cures at ambient temperature or at a low elevated temperature produced by passing an electrical current through the heating element (30), to bond the pieces (12 and 14) together. The pieces (12 and 14) are debonded or separated by passing a relatively high electrical power through the heating element (30), to soften or melt the adhesive (28). A preferred adhesive (28) is a cyanoacrylate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.