Thermally stable, reactive organometallic compositions containing copper
US5100575A · kind A · utility
3Cited by
4References
42Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 2, 1990 |
| Grant date | Mar 31, 1992 |
| Priority date | — |
| Expiry date | Feb 2, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07F1/08
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
An organometallic composition containing copper(I) comprising: PA1 (a) an organometallic composition of the formula EQU R.sub.T R.sub.R CuLi wherein R.sub.T is a transferable anionic group, R.sub.R is a residual anionic group and containing 0.01 to 1.2 mole equivalents of halide in the form of chloride, bromide or iodide; 0 to 0.12 mole equivalents of magnesium; 0.5 to 7 mole equivalents of a Lewis base and a solvating amount of a liquid hydrocarbon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.