Solder-repelling coating for tools

US5100701A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Helmut Freller · Westerburg, DE
• Hans Lorenz · Darmstadt, DE
• Friedrich Horauf · Nuremberg, DE
• Peter Schack · Nuremberg, DE

Key dates

• Filing date: Feb 2, 1990
• Grant date: Mar 31, 1992
• Expiry date: Feb 2, 2010

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31544
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Especially in gripper, insertion and bending tools of automatic insertion machines for electric components, the problem arises, that the production flow is adversely influenced because of solder accumulations at the tools. In machine design it is already known to apply hard material layers on a nitride base to improve tool surfaces; normally, better solder resistance is expected of them. According to the invention at least one second layer is provided as the cover layer with solid-lubricant properties, besides the nitride base layer. The base layer has here preferably a gradual change from high density in the boundary region to the base material of the tool to a porous rough structure at the boundary surface to the cover layer, where the change of the density can be continuous. The metal-nitride layer is advantageously a titanium nitride. With such coatings, the service life of the tools can be increased by more than one order of magnitude.