Thin platinum film-forming composition
US5100702A · kind A · utility
22Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1991 |
| Grant date | Mar 31, 1992 |
| Priority date | — |
| Expiry date | Feb 19, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/105
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A thin platinum film is formed on a substrate of glass, alumina or pottery by applying on the surface of the substrate a solution containing one part by weight of an organic platinum complex represented by formula (I): EQU PT (R.sup.1 --C.tbd.C--R.sup.2).sub.2 (I) wherein R.sup.1 and R.sup.2 each represents a group of phenyl, 4-methylphenyl or 4-methoxyphenyl and 0.1 to 100 parts by weight of an organic solvent dissolving the complex, then heating the coated film at the decomposition temperature of the complex and thereafter firing the film and 400.degree. to 900.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.