Water developable photosensitive resin composition, and resin or printing plate therefrom
US5100763A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1990 |
| Grant date | Mar 31, 1992 |
| Priority date | — |
| Expiry date | Mar 12, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/11
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is a water-developable photosensitive resin composition capable of hot melt molding, which comprises: PA0 (i) a water soluble or water dispersible polyvinyl alcohol prepared by saponifying a copolymer of a vinyl ester and another copolymerizable monomer, which has a saponification degree of the vinyl ester unit of 50 to 70 mol % and a hot melt flow starting temperature of 60.degree. to 130.degree. C., PA0 (ii) a polymerizable monomer, and PA0 (iii) a photopolymerization initiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.