Microvoided supports for receiving element used in thermal dye transfer
US5100862A · kind A · utility
34Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 1991 |
| Grant date | Mar 31, 1992 |
| Priority date | — |
| Expiry date | Jul 22, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A dye-receiving element for thermal dye transfer including a support having thereon a polymeric dye image-receiving layer wherein the support includes a continuous oriented polymer matrix having dispersed therein microbeads of a cross-linked polymer coated with a slip agent and which are at least partially bordered by void space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.