Aqueous formulations suitable as sealing compounds of adhesives for ceramic tiles
US5100948A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 1990 |
| Grant date | Mar 31, 1992 |
| Priority date | — |
| Expiry date | Jun 27, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J133/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Aqueous formulations suitable as sealing compounds or adhesives for ceramic tiles essentially contain PA0 A) from 3 to 30% by weight of plastics particles which consist of PA1 a) from 0.1 to 4% by weight of one or more mercaptosilanes of the general formula I ##STR1## where n is from 1 to 8, R.sup.1 and R.sup.2 are hydrogen and/or C.sub.1 -C.sub.4 -alkyl, R.sup.3, R.sup.4 and R.sup.5 are C.sub.1 -C.sub.6 -alkyl and/or C.sub.1 -C.sub.6 -alkoxy, with the proviso that one or more of the radicals R.sup.3 to R.sup.5 is alkoxy, and PA1 b) ethylenically unsaturated monomers capable of undergoing free radical polymerization, as the residual amount, PA0 the polymer having a glass transition temperature of from -60 to +40.degree. C., PA0 B) from 40 to 90% by weight of an inorganic filler, PA0 C) an effective amount of an emulsifier, PA0 D) from 0 to 15% by weight external plasticizer and PA0 E) from 5 to 40% by weight of water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.