Structure, method of, and apparatus for mounting semiconductor devices
US5101324A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 28, 1990 |
| Grant date | Mar 31, 1992 |
| Priority date | — |
| Expiry date | Feb 28, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices are each arranged such that a semiconductor chip is disposed on a film carrier, fingers of the film carrier are respectively connected to a multiplicity of electrodes provided on the semiconductor chip, and the fingers are then trimmed, or the fingers are trimmed after the semiconductor chip and parts of the fingers are sealed with a resin or the like. The semiconductor devices thus arranged are respectively mounted on both obverse and reverse surfaces of a substrate at mutually opposing positions thereof, the substrate having electrically conductive patterns formed on both surfaces thereof. The semiconductor devices are sealed with a resin or the like so as to be formed integrally with the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.