Method for manufacturing a semiconductor card with electrical contacts on both faces
US5102828A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 20, 1989 |
| Grant date | Apr 7, 1992 |
| Priority date | — |
| Expiry date | Apr 20, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49135
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Two superimposed series of electric contacts in the shape of metal-sheet strips, electrically connected to a metallic place which supports a semiconductor chip, are electrically separated but mechanically connected by an interposed layer of adhesive material at high insulation. The whole is completely inserted in a covering of insulating material, which forms a flat support, from which, at opposite faces, only limited adjacent contact portions of said electric contacts emerge. The place and at least one of the two series of contacts make part of a single starting metallic frame, on which the other series of contacts is superimposed. This latter in its turn can make part of the same metallic frame and to be superimposed by refolding or can be prepared separately and then applied on the first series.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.