Flameproofed, non-dripping polyamide moulding compound
US5102931A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 1990 |
| Grant date | Apr 7, 1992 |
| Priority date | — |
| Expiry date | Jul 23, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/5313
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The subject of the invention is flameproofed, non-dripping polyamide moulding compounds which contain specific amounts of the following: PA0 A) Phosphinic acid esters of polyphenols based on phenolaldehyde/ketone condensates, PA0 B) Anti-dripping agents (such as polyfluoroethylene polymers or aramides), PA0 C) Zinc borate, PA0 D) Thermoplastics with a predominantly aromatic main chain and a high thermal deflection temperature (Vicat B.gtoreq.180.degree. C.), and, if applicable, reinforcing agents and other additives for flameproofing and processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.