Silicon-epoxy resin composition
US5102960A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 1989 |
| Grant date | Apr 7, 1992 |
| Priority date | — |
| Expiry date | Sep 11, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A silicone-epoxy resin composition comprising PA0 (A) 100 parts by weight of a curable epoxy resin, PA0 (B) 1-100 parts by weight of an epoxy resin-modified silicone resin obtained by a condensation reaction of 1-99 mole % of an epoxy resin having at least one hydroxyl group and at least one epoxy group and 1-99 mole % of an organosiloxane or organosilane compound represented by the general formula ##EQU1## wherein R.sup.1 represents a monvalent hydrocarbon group or a halogenated monovalent hydrocarbon group, R.sup.2 represents a hydrogen atom or a monovalent aliphatic hydrocarbon group, is a number ranging from 1 to 1,500; n is a number ranging from 0.9 to 3; and m is a number ranging from 0.05 to 3.1 with a proviso that the sum of m+n is not greater than 4, and PA0 (c) 1-100 parts by weight of an epoxy-modified polysiloxane having an epoxy equivalent ranging from 1,000 to 20,000, represented by the general formula ##STR1## wherein R.sup.3, R.sup.4, R.sup.5, R.sup.6, and R.sup.7 may be the same or different, each represents a lower alkyl group or a substituted or unsubstituted phenyl group; X.sup.1 represents a monovalent aliphatic hydrocarbon group or an epoxy-containing organic …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.