X-Y multiplex drive circuit and associated ink feed connection for maximizing packing density on thermal ink jet (TIJ) printheads
US5103246A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 15, 1991 |
| Grant date | Apr 7, 1992 |
| Priority date | — |
| Expiry date | Feb 15, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/19
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A X-Y multiplex drive circuit and associated ink feed arrangement for an ink jet printhead wherein resistive heater elements, X-Y electrical interconnects thereto and closely adjacent ink feed ports are integrated on or within a given printhead substrate surface area with a maximum packing density and a minimum of fluidic crosstalk. Ink feed channels are formed within a printhead barrier layer which separates an ink jet orifice plate from an underlying printhead substrate, and state-of-the-art MOS planar processes and thin film deposition processes may be used for fabricating this drive circuit and its associated ink feed arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.